DocumentCode
149071
Title
Heat dissipation within electrical switchgear enclosure
Author
Bedkowski, M. ; Smolka, J. ; Ryfa, A. ; Bulinski, Zbigniew ; Nowak, A.J.
Author_Institution
Inst. of Thermal Technol., Silesian Univ. of Technol., Gliwice, Poland
fYear
2014
fDate
March 31 2014-April 1 2014
Firstpage
1
Lastpage
2
Abstract
In this paper, the coupled numerical model was used to study the heat dissipation rate within the switchgear enclosure. The main focus in the analysis was on the natural convection cooling. Thus the modification of inlets/outlets was proposed to increase the volume of flowing air. As a result of this study, the cooling capability of the unit was increased. Moreover, the reduction in the busbars temperature and changes in the air flow patterns were observed.
Keywords
busbars; cooling; natural convection; packaging; air flow patterns; busbar temperature reduction; cooling capability; coupled numerical model; electrical switchgear enclosure; heat dissipation; natural convection cooling; air cooling; busbars; cooling optimisation; heat dissipation; switchgear;
fLanguage
English
Publisher
iet
Conference_Titel
Computation in Electromagnetics (CEM 2014), 9th IET International Conference on
Conference_Location
London
Electronic_ISBN
978-1-84919-817-2
Type
conf
DOI
10.1049/cp.2014.0219
Filename
6826848
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