• DocumentCode
    1491237
  • Title

    Integrated circuit testing for quality assurance in manufacturing: history, current status, and future trends

  • Author

    Grochowski, Andrew ; Bhattacharya, Debashis ; Viswanathan, T.R. ; Laker, Ken

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • Volume
    44
  • Issue
    8
  • fYear
    1997
  • fDate
    8/1/1997 12:00:00 AM
  • Firstpage
    610
  • Lastpage
    633
  • Abstract
    Integrated circuit (IC) testing for quality assurance is approaching 50% of the manufacturing costs for some complex mixed-signal ICs. For many years the market growth and technology advancements in digital ICs were driving the developments in testing. The increasing trend to integrate information acquisition and digital processing on the same chip has spawned increasing attention to the test needs of mixed-signal ICs. The recent advances in wireless communications indicate a trend toward the integration of the RF and baseband mixed signal technologies. In this paper we examine the developments in IC testing from the historic, current status and future view points. In separate sections we address the testing developments for digital, mixed signal and RF ICs. With these reviews as context, we relate new test paradigms that have the potential to fundamentally alter the methods used to test mixed-signal and RF parts
  • Keywords
    UHF integrated circuits; automatic test equipment; automatic testing; digital integrated circuits; integrated circuit testing; mixed analogue-digital integrated circuits; production testing; quality control; reviews; IC testing; RF ICs; digital ICs; integrated circuit testing; manufacturing; mixed-signal ICs; quality assurance; review; Baseband; Circuit testing; Costs; Integrated circuit manufacture; Integrated circuit technology; Integrated circuit testing; Quality assurance; RF signals; Radio frequency; Wireless communication;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems II: Analog and Digital Signal Processing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1057-7130
  • Type

    jour

  • DOI
    10.1109/82.618036
  • Filename
    618036