High density packaging of X-band active array modules

Author

Hauhe, Mark S. ; Wooldridge, John J.

Author_Institution

Microwave Div., Hughes Aircraft Co., El Segundo, CA, USA

Volume

20

Issue

3

fYear

1997

fDate

8/1/1997 12:00:00 AM

Firstpage

279

Lastpage

291

Abstract

A new high-density package design has been used to reduce the cost, weight, and size of X-band active array radars. The package used multilayer aluminum nitride (AlN) substrates, flipped monolithic microwave integrated circuit (MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnects. This paper discusses the design tradeoffs, the package construction and assembly, and test results

Keywords

MMIC; active antenna arrays; aluminium compounds; coplanar waveguides; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; radar receivers; radar transmitters; transceivers; AlN; X-band; active array modules; active array radars; assembly; coplanar waveguide transmission lines; flipped MMIC chips; high-density package design; multilayer substrates; package construction; solderless fuzz button interconnects; Aluminum nitride; Coplanar transmission lines; Coplanar waveguides; Costs; Integrated circuit packaging; MMICs; Microwave integrated circuits; Monolithic integrated circuits; Nonhomogeneous media; Radar;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.618228

Filename

618228