Cost-effective multichip module manufacture using passive substrate fault tolerance

Author

Peacock, Christopher ; Bolouri, Hamid ; Habiger, Claus

Author_Institution

Eng. Res. & Dev. Centre, Hertfordshire Univ., Hatfield, UK

Volume

20

Issue

3

fYear

1997

fDate

8/1/1997 12:00:00 AM

Firstpage

320

Lastpage

326

Abstract

The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem. This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture. The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture

Keywords

integrated circuit yield; multichip modules; quality control; substrates; generic processor-memory architecture; known good die problem; multichip module manufacture; paged address space; passive substrate fault tolerance; quality level; spare memory dies; substrate cost; substrate yield; yield enhancement; Application specific integrated circuits; Circuit testing; Costs; Fault tolerance; Integrated circuit technology; Integrated circuit yield; Manufacturing processes; Multichip modules; Packaging; Space technology;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.618232

Filename

618232