Title :
Simulation of Electromagnetic Transients of the Bus Bar in Substation by the Time-Domain Finite-Element Method
Author :
Liu, Lei ; Cui, Xiang ; Qi, Lei
Author_Institution :
Sch. of Electr. & Electron. Enginnering, North China Electr. Power Univ., Baoding, China
Abstract :
In order to analyze the electromagnetic interference (EMI) generated from the aerial bus bars in substation, the transient electromagnetic wave process on the bus bars is calculated by using the time-domain finite-element (TDFE) method. The TDFE method is preferable to both the commonly used finite-difference time-domain (FDTD) method, which has difficulties in dealing with the multiconductor transmission lines (MTLs) with lumped parameter networks, and the universal software electromagnetic transient program (EMTP), which is not effective for the calculation of the whole electromagnetic wave processes along the MTLs. The feasibility and efficiency of the proposed TDFE method have been demonstrated by comparing the numerical results with experimental measurements. Furthermore, we have performed a successful case study on the numerical prediction of the EMI in the secondary cable in substation by using the TDFE method.
Keywords :
EMTP; busbars; electromagnetic interference; finite difference time-domain analysis; finite element analysis; lumped parameter networks; substation protection; electromagnetic interference; electromagnetic transient program; electromagnetic transients simulation; finite-difference time-domain method; lumped parameter networks; multiconductor transmission lines; substation bus bar; time-domain finite-element method; transient electromagnetic wave process; Bars; EMTP; Electromagnetic analysis; Electromagnetic interference; Electromagnetic scattering; Finite difference methods; Finite element methods; Power system transients; Substations; Time domain analysis; Capacitance voltage transformer (CVT); lumped parameter network; multiconductor transmission lines (MTLs); time-domain finite element (TDFE);
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2009.2028691