• DocumentCode
    1496871
  • Title

    InAlN/GaN MOSHEMT With Self-Aligned Thermally Generated Oxide Recess

  • Author

    Alomari, M. ; Medjdoub, F. ; Carlin, J.-F. ; Feltin, E. ; Grandjean, N. ; Chuvilin, A. ; Kaiser ; Gaquiére, C. ; Kohn, E.

  • Author_Institution
    Inst. of Electron Devices & Circuits, Ulm Univ., Ulm, Germany
  • Volume
    30
  • Issue
    11
  • fYear
    2009
  • Firstpage
    1131
  • Lastpage
    1133
  • Abstract
    We report on lattice-matched InAlN/GaN MOSHEMTs with an oxide-filled recess, self-aligned to the gate prepared by thermal oxidation at 800degC in oxygen atmosphere. The device delivered a maximum current density of 2.4 A/mm. Pulse measurements showed no apparent lag effects, indicating a high-quality native oxide. This was confirmed by monitoring the radio-frequency load lines in the time domain. The MOSHEMT yielded a power density of 6 W/mm at a drain voltage as low as 20 V and at 4 GHz, a power added efficiency of 32% and an ft and f max of 61 and 112 GHz, respectively, illustrating the capability of such MOSHEMT to operate at high frequencies.
  • Keywords
    III-V semiconductors; MOS integrated circuits; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; oxidation; pulse measurement; wide band gap semiconductors; InAlN-GaN; efficiency 32 percent; lattice matched MOSHEMT; oxide filled recess; oxygen atmosphere; power added efficiency; pulse measurements; radiofrequency load lines; temperature 800 degC; thermal oxidation; thermally generated oxide recess; InAlN/GaN; MOSHEMT; thermal oxidation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2009.2031659
  • Filename
    5282551