• DocumentCode
    1498554
  • Title

    Compensation Design for DC Blocking Multilayer Ceramic Capacitor in High-Speed Applications

  • Author

    Lai, Qiang-Tao ; Mao, Jun-Fa ; Zhang, Mu-Shui

  • Author_Institution
    Key Lab. of Design & Electromagn. Compatibility of High Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
  • Volume
    1
  • Issue
    5
  • fYear
    2011
  • fDate
    5/1/2011 12:00:00 AM
  • Firstpage
    742
  • Lastpage
    751
  • Abstract
    The shunt parasitic capacitance of a multilayer ceramic capacitor (MLCC) mounting structure seriously degrades the performance of the MLCC in high-speed applications. In this paper, we propose a new compensation design method with which the reference planes underneath the surface mount technology pads and MLCC are cleared to eliminate the excessive capacitance effect. An analytical model is derived to compute the optimal clear parameters using conformal mapping, and the result of the analytical model closely matches with that of Ansoft 2-D Extractor. It is convenient for the printed circuit board (PCB) designer to utilize this model to obtain the optimal compensation parameters without building the 2-D or 3-D models of the MLCC mounting structure. Simulation and measurement results show that the compensation design is effective in improving the signal integrity of dc blocking MLCCs mounted on high-speed PCBs.
  • Keywords
    ceramic capacitors; compensation; conformal mapping; printed circuits; surface mount technology; Ansoft 2-D extractor; DC blocking multilayer ceramic capacitor; capacitance effect; compensation design method; conformal mapping; optimal compensation parameter; printed circuit board; reference plane; shunt parasitic capacitance; signal integrity; surface mount technology pad; Capacitance; Capacitors; Computational modeling; Conformal mapping; Electrodes; Impedance; Integrated circuit modeling; Compensation design; conformal mapping; multilayer ceramic capacitor; signal integrity; surface mount technique pad;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2011.2116016
  • Filename
    5752832