DocumentCode :
1498992
Title :
Errors in Projecting Gate Dielectric Reliability From Fowler–Nordheim Stress to Direct-Tunneling Operation
Author :
Nicollian, Paul E.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Volume :
30
Issue :
11
fYear :
2009
Firstpage :
1185
Lastpage :
1187
Abstract :
The extrapolation of gate dielectric reliability of devices that are stressed in the Fowler-Nordheim (F-N) tunneling regime but operate in the direct-tunneling (D-T) region is analyzed using the time-dependent dielectric-breakdown power law model. Due to the differences in the slopes of the gate current versus voltage characteristics between F-N and D-T, the widely established practice of directly extrapolating the time to breakdown from stress to operating conditions is, in general, not rigorously correct. Reliability projections across a wide voltage space can have significant errors, and the operating voltage that a technology can safely sustain may be overestimated.
Keywords :
MOSFET; error analysis; extrapolation; semiconductor device breakdown; semiconductor device reliability; stress effects; tunnelling; Fowler-Nordheim stress; MOSFET devices; direct tunneling; error analysis; extrapolation; gate current-voltage characteristics; gate dielectric reliability projections; time-dependent dielectric-breakdown power law model; Breakdown; SiON; dielectric; oxide; reliability; time-dependent dielectric breakdown (TDDB);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2009.2030698
Filename :
5286211
Link To Document :
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