• DocumentCode
    150358
  • Title

    Evaluation of a maximum power density design method for matrix converter using SiC-MOSFET

  • Author

    Koiwa, K. ; Itoh, Jun-ichi

  • Author_Institution
    Dept. of Electr. Eng., Nagaoka Univ. of Technol., Nagaoka, Japan
  • fYear
    2014
  • fDate
    14-18 Sept. 2014
  • Firstpage
    563
  • Lastpage
    570
  • Abstract
    This paper discusses a maximum power density design for a matrix converter using SiC device based on front loading design. In order to design the matrix converter at maximum power density, the conduction loss and the switching loss of the matrix converter are derived theoretically. Based on these equations, the relationship between the efficiency and power density are discussed by Pareto-front curve in order to solve the tread-off problem between the power density and the efficiency. From the experimental results, the maximum efficiency is 98.3% with two phase modulation at 3.9-kW output power and 25-kHz switching frequency (Devices: SiC-MOSFET BSM00003A ROHM). Moreover, the maximum power density of the matrix converter reaches 2.12 kW/dm3 (the design value is 2.22 kW/dm3) with a natural air cooling. Thus, the design method of a high power density AC-AC converter using a matrix converter is established according to the specifications.
  • Keywords
    AC-AC power convertors; frequency convertors; matrix convertors; phase convertors; phase modulation; power MOSFET; switching convertors; Pareto-front curve; SiC device; SiC-MOSFET BSM00003A ROHM; conduction loss; frequency 25 kHz; front loading design; high power density AC-AC converter; matrix converter; maximum power density design; natural air cooling; output power switching frequency; phase modulation; power 3.9 kW; switching loss; trade-off problem; Density measurement; Heating; Matrix converters; Power system measurements; Prototypes; Switches; Switching frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2014 IEEE
  • Conference_Location
    Pittsburgh, PA
  • Type

    conf

  • DOI
    10.1109/ECCE.2014.6953444
  • Filename
    6953444