DocumentCode :
1505466
Title :
Aggressively Scaled Strained-Silicon-on-Insulator Undoped-Body High- \\kappa /Metal-Gate nFinFETs for High-Performance Logic Applications
Author :
Maitra, Kingsuk ; Khakifirooz, Ali ; Kulkarni, Pranita ; Basker, Veeraraghavan S. ; Faltermeier, Jonathan ; Jagannathan, Hemanth ; Adhikari, Hemant ; Yeh, Chun-Chen ; Klymko, Nancy R. ; Saenger, Katherine ; Standaert, Theodorus ; Miller, Robert J. ; Doris
Author_Institution :
Globalfoundries Inc., Albany, NY, USA
Volume :
32
Issue :
6
fYear :
2011
fDate :
6/1/2011 12:00:00 AM
Firstpage :
713
Lastpage :
715
Abstract :
Strained-silicon-on-insulator (SSOI) undoped-body high-κ /metal-gate n-channel fin-shaped field-effect transistors (nFinFETs) at scaled gate lengths and pitches (i.e.,LGATE ~ 25 nm and a contacted gate pitch of 130 nm) were fabricated using a gate-first flow. A “long and narrow” fin layout (i.e., fin length ~ 1 μm) was leveraged to preserve uniaxial tensile strain in the transistors. These devices exhibit drive currents suitable for high-performance logic technology. The change in the slope of RON - LGATE (dRON/dLGATE), transconductance GMSAT, and injection velocity (vinj) measurements indicate a ~ 15% mobility-induced ION enhancement with SSOI relative to SOI nFinFETs at ultrashort gate lengths. Raman measurements conducted on SSOI substrates after fin formation demonstrate the preservation of ~ 1.3-GPa uniaxial tensile strain even after 1100°C annealing.
Keywords :
field effect transistors; silicon-on-insulator; fin layout; fin-shaped field-effect transistors; high-performance logic applications; injection velocity; strained-silicon-on-insulator; transconductance; undoped-body high-κ/metal-gate nFinFET; uniaxial tensile strain; FinFETs; Logic gates; Performance evaluation; Silicon; Substrates; Tensile strain; Fin-shaped field-effect transistor (FinFET); high- $kappa$; metal gate; strained silicon on insulator (SSOI);
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2011.2126556
Filename :
5756638
Link To Document :
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