DocumentCode :
1506006
Title :
Electrothermal simulation of an IGBT PWM inverter
Author :
Mantooth, H. Alan ; Hefner, Allen R., Jr.
Author_Institution :
Analogy Inc., Beaverton, OR, USA
Volume :
12
Issue :
3
fYear :
1997
fDate :
5/1/1997 12:00:00 AM
Firstpage :
474
Lastpage :
484
Abstract :
An electrothermal network simulation methodology is used to analyze the behavior of a full-bridge, pulse-width-modulated (PWM), voltage-source inverter, which uses insulated gate bipolar transistors (IGBTs) as the switching devices. The electrothermal simulations are performed using the Saber circuit simulator and include control logic circuitry, IGBT gate drivers, the physics-based IGBT electrothermal model, and thermal network component models for the power-device silicon chips, packages, and heat sinks. It is shown that the thermal response of the silicon chip determines the IGBT temperature rise during the device switching cycle. The thermal response of the device TO247 package and silicon chip determines the device temperature rise during a single phase of the 60-Hz sinusoidal output. Also, the thermal response of the heat sink determines the device temperature rise during the system startup and after load-impedance changes. It is also shown that the full electrothermal analysis is required to accurately describe the power losses and circuit efficiency
Keywords :
PWM invertors; bridge circuits; circuit analysis computing; heat sinks; insulated gate bipolar transistors; losses; packaging; power semiconductor switches; thermal analysis; 60 Hz; IGBT PWM inverter; IGBT gate drivers; IGBT temperature rise; Saber circuit simulator; TO247 package; control logic circuitry; electrothermal network simulation methodology; electrothermal simulation; full-bridge VSI; heat sinks; load-impedance changes; physics-based IGBT electrothermal model; power losses; power-device packages; power-device silicon chips; startup; switching devices; thermal network component models; thermal response; voltage-source inverter; Analytical models; Circuit simulation; Electrothermal effects; Heat sinks; Insulated gate bipolar transistors; Packaging; Pulse inverters; Pulse width modulation inverters; Silicon; Temperature;
fLanguage :
English
Journal_Title :
Power Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-8993
Type :
jour
DOI :
10.1109/63.575675
Filename :
575675
Link To Document :
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