Title :
Manufacturing experience with high performance mixed dielectric circuit boards
Author :
Farquhar, Donald S. ; Seman, Andrew C. ; Poliks, Mark D.
Author_Institution :
IBM Microelectron., Endicott, NY, USA
fDate :
5/1/1999 12:00:00 AM
Abstract :
A wide range of advanced dielectric materials are available for use in high speed digital and RF/microwave printed circuit boards (PCBs). These materials present new challenges in the manufacturing process, especially when they are combined in mixed or unbalanced structures. The properties of these materials are reviewed, and their impact on manufacturing in various product applications is discussed
Keywords :
laminates; packaging; printed circuit manufacture; RF printed circuit boards; advanced dielectric materials; high speed digital boards; manufacturing process; microwave printed circuit boards; mixed dielectric circuit boards; mixed structures; product applications; unbalanced structures; Costs; Dielectric constant; Dielectric materials; Laminates; Manufacturing; Packaging; Printed circuits; Radio frequency; Temperature dependence; Wiring;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.763186
