DocumentCode :
1506365
Title :
Influence of a floating plane on effective ground plane inductance in multilayer and coplanar packages
Author :
Lopez, Michael ; Prince, John L. ; Cangellaris, Andreas C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
22
Issue :
2
fYear :
1999
fDate :
5/1/1999 12:00:00 AM
Firstpage :
182
Lastpage :
188
Abstract :
The impact of a floating metal layer on the effective ground plane inductance has been investigated in both multilayer (ground planes) and coplanar (ground conductors) packages. For the multilayer case, both thick and thin film geometries were examined, and the results were compared to a thin film coplanar configuration. It was seen that the floating plane actually increases the ground plane inductance in the multilayer case and decreases the ground plane inductance in the lead frame case. Examining the current density in the floating and ground plane and the ground´s partial self-inductance and ground-signal partial mutual inductance give a detailed explanation for this phenomenon
Keywords :
inductance; packaging; coplanar package; current density; floating metal layer; floating plane; ground conductor; ground plane inductance; lead frame; multilayer package; mutual inductance; self-inductance; thick film; thin film; Coplanar transmission lines; Driver circuits; Equations; Inductance; Noise reduction; Nonhomogeneous media; Packaging; Power system transients; Transistors; Voltage fluctuations;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/6040.763190
Filename :
763190
Link To Document :
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