Title :
Frequency response characteristics of reference plane effective inductance and resistance [IC packaging]
Author :
Xie, Xuebing ; Prince, John L.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fDate :
5/1/1999 12:00:00 AM
Abstract :
A method which uses the partial element equivalent circuit (PEEC) method and electrical network theory to solve for the effective impedance matrix of reference planes is presented. The convergence and accuracy of the method are checked. The frequency responses of the effective inductance (Leff(f)) and resistance (Reff(f)) of reference plane are discussed. The effects of current redistribution and the skin effect on Leff(f) and R eff(f) are discussed. The effect of number of sinks and sources is examined
Keywords :
convergence of numerical methods; current distribution; electric resistance; equivalent circuits; frequency response; impedance matrix; inductance; integrated circuit packaging; skin effect; convergence; current redistribution; effective impedance matrix; electrical network theory; frequency response characteristics; partial element equivalent circuit method; reference plane effective inductance; reference plane effective resistance; skin effect; Conductors; Electric resistance; Electronics packaging; Frequency response; Impedance; Inductance; Integrated circuit packaging; Semiconductor device noise; Switches; Voltage;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.763195
