• DocumentCode
    1506975
  • Title

    Suppression of the floating-body effect in partially-depleted SOI MOSFETs with SiGe source structure and its mechanism

  • Author

    Nishiyama, Akira ; Arisumi, Osamu ; Yoshimi, Makoto

  • Author_Institution
    Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
  • Volume
    44
  • Issue
    12
  • fYear
    1997
  • fDate
    12/1/1997 12:00:00 AM
  • Firstpage
    2187
  • Lastpage
    2192
  • Abstract
    SiGe layers were formed in source regions of partially-depleted 0.25-μm SOI MOSFETs by Ge implantation, and the floating-body effect was investigated for this SiGe source structure. It is found that the increase of the Ge implantation dosage suppresses kinks in Id-Vd characteristics and that the kinks disappear for devices with a Ge dose of 3×1016 cm-2. The lowering of the drain breakdown voltage and the anomalous decrease of the subthreshold swing are also suppressed with this structure. It is confirmed that this suppression effect originates from the decrease of the current gain for source/channel/drain lateral bipolar transistors (LBJTs) with the SiGe source structure. The temperature dependence of the base current indicates that the decrease of the current gain is ascribed to the bandgap narrowing of the source region
  • Keywords
    Ge-Si alloys; MOSFET; ion implantation; semiconductor materials; silicon-on-insulator; 0.25 micron; Ge implantation; I-V characteristics; SiGe; SiGe source; bandgap narrowing; current gain; drain breakdown voltage; floating-body effect; lateral bipolar transistor; partially-depleted SOI MOSFET; subthreshold swing; Bipolar transistors; Germanium silicon alloys; Impact ionization; Laboratories; Large scale integration; MOSFET circuits; Oxidation; Photonic band gap; Silicon germanium; Temperature dependence;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.644634
  • Filename
    644634