DocumentCode
1506975
Title
Suppression of the floating-body effect in partially-depleted SOI MOSFETs with SiGe source structure and its mechanism
Author
Nishiyama, Akira ; Arisumi, Osamu ; Yoshimi, Makoto
Author_Institution
Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
Volume
44
Issue
12
fYear
1997
fDate
12/1/1997 12:00:00 AM
Firstpage
2187
Lastpage
2192
Abstract
SiGe layers were formed in source regions of partially-depleted 0.25-μm SOI MOSFETs by Ge implantation, and the floating-body effect was investigated for this SiGe source structure. It is found that the increase of the Ge implantation dosage suppresses kinks in Id-Vd characteristics and that the kinks disappear for devices with a Ge dose of 3×1016 cm-2. The lowering of the drain breakdown voltage and the anomalous decrease of the subthreshold swing are also suppressed with this structure. It is confirmed that this suppression effect originates from the decrease of the current gain for source/channel/drain lateral bipolar transistors (LBJTs) with the SiGe source structure. The temperature dependence of the base current indicates that the decrease of the current gain is ascribed to the bandgap narrowing of the source region
Keywords
Ge-Si alloys; MOSFET; ion implantation; semiconductor materials; silicon-on-insulator; 0.25 micron; Ge implantation; I-V characteristics; SiGe; SiGe source; bandgap narrowing; current gain; drain breakdown voltage; floating-body effect; lateral bipolar transistor; partially-depleted SOI MOSFET; subthreshold swing; Bipolar transistors; Germanium silicon alloys; Impact ionization; Laboratories; Large scale integration; MOSFET circuits; Oxidation; Photonic band gap; Silicon germanium; Temperature dependence;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.644634
Filename
644634
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