Title :
The effect of body contact series resistance on SOI CMOS amplifier stages
Author :
Edwards, Christopher F. ; Redman-White, William ; Tenbroek, Bernard M. ; Lee, Michael S L ; Uren, Michael J.
Author_Institution :
Dept. of Electron. & Comput. Sci., Southampton Univ., UK
fDate :
12/1/1997 12:00:00 AM
Abstract :
This paper examines some implications for analogue design of using body ties as a solution to the problem of floating body effects in partially-depleted (PD) SOI technologies. Measurements on H-gate body-tied structures in a 0.7-μm SOI process indicate body-tie series resistances increasing into the MΩ region. Both circuit simulation and measurement results reveal a delayed but sharper kink effect as this resistance increases. The consequences of this effect are shown in the context of a simple amplifier configuration, resulting in severe bias-dependent degradation in the small signal gain characteristics as the body-tie resistance enters the MΩ region. It is deduced that imperfectly body tied devices may be worse for analogue design than using no body-tie at all
Keywords :
CMOS analogue integrated circuits; DC amplifiers; circuit CAD; circuit analysis computing; contact resistance; integrated circuit design; silicon-on-insulator; 0.7 micron; H-gate body-tied structures; SOI CMOS amplifier stages; amplifier configuration; analogue design; bias-dependent degradation; body contact series resistance; body ties; circuit simulation; imperfectly body tied devices; kink effect; partially-depleted technology; small signal gain characteristics; Circuit simulation; Contact resistance; Coupling circuits; Degradation; Delay effects; Digital signal processing; Electrical resistance measurement; Immune system; Impact ionization; Integrated circuit modeling;
Journal_Title :
Electron Devices, IEEE Transactions on