DocumentCode :
1513900
Title :
New self-aligned T-gate InGaP/GaAs field-effect transistors grown by LP-MOCVD
Author :
Lour, W.-S. ; Chang, W.L. ; Shih, Y.M. ; Liu, W.C.
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan-Ocean Univ., China
Volume :
20
Issue :
6
fYear :
1999
fDate :
6/1/1999 12:00:00 AM
Firstpage :
304
Lastpage :
306
Abstract :
This paper reports on self-aligned T-gate InGaP/GaAs FETs using n/sup +//N/sup +///spl delta/(P/sup +/)/n structures. N/sup +/-InGaP//spl delta/(P/sup +/)-InGaP/n-GaAs forms a planar-doped barrier. The inherent ohmic gate of camel-gate FETs together with a highly selective etch between an InGaP and a GaAs layers offers a self-aligned T-shape gate with a reduced effective length. A fabricated device with a reduced gate dimension of 1.5×100 (0.6×100) μm2 obtained from 2×100 (1×100) μm2 gate metal exhibits an extrinsic transconductance, unity-current gain frequency, and unity-power gain frequency of 78 (80) mS/mm, 9 (19.5), and 28 (30) GHz, respectively.
Keywords :
III-V semiconductors; MOCVD coatings; field effect transistors; gallium arsenide; gallium compounds; indium compounds; CAMFET; InGaP-GaAs; LP-MOCVD growth; ohmic gate; planar doped barrier; selective etching; self-aligned T-gate InGaP/GaAs field effect transistor; transconductance; unity-current gain frequency; unity-power gain frequency; Electrodes; Energy barrier; Etching; FETs; Fabrication; Frequency; Gallium arsenide; Gold; Heterojunctions; Transconductance;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.767106
Filename :
767106
Link To Document :
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