Title :
The Future of Signoff
Author :
Kahng, Andrew B.
Author_Institution :
Univ. of California, San Diego, CA, USA
Abstract :
This column examines the challenges inherent in the signoff stage of the design cycle just prior to fabrication. Modeling trends, as well as trends from the designer side, and their possible effects on signoff are identified.
Keywords :
SPICE; integrated circuit design; SPICE; design cycle signoff stage; signoff future; design and test; physical design; signoff;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2011.66
