Title :
Environmental Influence on Sn Whisker Growth
Author :
Dimitrovska, Aleksandra ; Kovacevic, Radovan
Author_Institution :
Res. Center for Adv. Manuf., Southern Methodist Univ., Dallas, TX, USA
fDate :
7/1/2010 12:00:00 AM
Abstract :
This paper considers the influence of 1) humidity and 2) acidic humidity on the growth of Sn whiskers. Sn whisker morphology was observed over a six-month period. The results show that the electroplated surfaces exposed to pure humidity are populated with Sn whiskers dimensionally smaller than surfaces exposed to acidic humidity. Variables analyzed include surface condition, Cu-Sn inter-metallic formation at the film/substrate interface by X-ray Diffraction (XRD), and film thickness.
Keywords :
X-ray diffraction; electroplating; humidity; tin; whiskers (crystal); Sn; X-ray diffraction; XRD; acidic humidity; electroplated surfaces; film thickness; whisker growth; whisker morphology; Coatings; Compressive stress; Electronic components; Grain boundaries; Humidity; Manufacturing; Surface morphology; Tin; X-ray diffraction; X-ray scattering; ${hbox {Cu}}_{6}{hbox {Sn}}_{5}$ intermetallic compounds (IMCs); Sn electroplating; Sn whisker growth; X-ray Diffraction (XRD); oxidation;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2010.2048034
