3D-integrated, low-height, small module design techniques for 4.48GHz, 560MHz-bandwidth TransferJet™ transceiver

Author

Agawa, Kenichi ; Seto, Ichiro ; Happoya, Akihiko ; Iida, Yuki ; Imaizumi, Yukari ; Okano, Makoto ; Suzuki, Daisuke ; Sato, Yuuki ; Iwanaga, Motoki ; Sato, Kiminori ; Arai, Shigehisa ; Uchida, Noriki ; Ryugo, Koji ; Miyashita, D. ; Fujimoto, Richard ; Unek

Author_Institution

Semicond. & Storage Products Co., Toshiba Corp., Kawasaki, Japan

fYear

2014

fDate

19-23 Jan. 2014

Firstpage

76

Lastpage

78

Abstract

A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8mm × 1.0mm. Since RF signals are degraded by parasitic capacitance associated with the low height and small footprint of the module, three design techniques are proposed in the paper. The module realizes the world´s smallest size, and achieves sufficient transmitter modulation accuracy and receiver sensitivity, which meet TransferJet™ standards.

Keywords

UHF integrated circuits; microwave integrated circuits; radio transceivers; 3D integration technology; 3D-integrated small module design techniques; RF baseband circuits; TransferJet transceiver; bandwidth transceiver; carrier frequency; digital baseband circuits; frequency 4.48 GHz; frequency 560 MHz; low-height small module design techniques; organic resin substrate; parasitic capacitance; receiver sensitivity; transmitter modulation accuracy; Band-pass filters; Degradation; Impedance matching; Large scale integration; Parasitic capacitance; Radio frequency; Transceivers; 3D integration; TransferJet™ transceiver; UWB; high frequency; low-height module; wide bandwidth;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Symposium (RWS), 2014 IEEE

Conference_Location

Newport Beach, CA

Print_ISBN

978-1-4799-2298-7

Type

conf

DOI

10.1109/RWS.2014.6830099

Filename

6830099