DocumentCode
1521233
Title
A new empirical large-signal model of Si LDMOSFETs for high-power amplifier design
Author
Yang, Youngoo ; Woo, Young Yun ; Yi, Jaehyok ; Kim, Bumman
Author_Institution
Dept. of Electron. & Electr. Eng., Pohang Univ. of Sci. & Technol., South Korea
Volume
49
Issue
9
fYear
2001
fDate
9/1/2001 12:00:00 AM
Firstpage
1626
Lastpage
1633
Abstract
We propose a new empirical large-signal model of silicon laterally diffused MOSFETs for the design of various modes of high-power amplifiers. The new channel current model has only nine parameters that represent the unique operation principles of a MOSFET. In the channel current model, we include the thermal phenomena of high-power devices. To accurately characterize high-power devices, we incorporate the channel heating and heat-sink heating effects by providing two thermal capacitances and two thermal resistances. Nonlinear capacitances, including deep subthreshold and triode regions, as well as normal saturation regions, are extracted and modeled. For validation of our model, a 1.4-GHz 5-W amplifier is implemented, and the measured and simulated results match very well
Keywords
UHF field effect transistors; UHF power amplifiers; capacitance; elemental semiconductors; equivalent circuits; power MOSFET; semiconductor device models; silicon; thermal resistance; 1.4 GHz; 5 W; Si; Si LDMOSFETs; channel current model; channel heating effects; deep subthreshold region; empirical large-signal model; heat-sink heating effects; high-power amplifier design; high-power devices; laterally diffused MOSFETs; nonlinear capacitances extraction; normal saturation regions; thermal capacitances; thermal phenomena; thermal resistances; triode region; Electrical resistance measurement; High power amplifiers; MOSFETs; Power system modeling; Pulse measurements; Radiofrequency amplifiers; Resistance heating; Silicon; Temperature; Thermal resistance;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.942576
Filename
942576
Link To Document