SMD placement on three-dimensional circuit boards

Author

Zussman, Eyal

Author_Institution

Dept. of Mech. Eng., Technion-Israel Inst. of Technol., Haifa, Israel

Volume

22

Issue

2

fYear

1999

fDate

4/1/1999 12:00:00 AM

Firstpage

147

Lastpage

150

Abstract

The effectiveness of surface-mount devices (SMD) placement on three-dimensional (3-D) molded interconnect devices (MID) is influenced by a number of factors, including component accuracy, the assembly machine, and the device itself. The objective of this research project was to model dimensional variations and further optimize the placement process. Optimal placement is achieved by determining the best lead-to-pad coverage. The chosen approach is demonstrated by simulating the placement process. Results show that the process can be significantly improved through an optimization procedure

Keywords

assembling; circuit optimisation; printed circuit manufacture; surface mount technology; SMD placement; assembly machine; component accuracy; dimensional variations; lead-to-pad coverage; molded interconnect devices; optimization procedure; placement process; three-dimensional circuit boards; Assembly systems; Circuit simulation; Fixtures; Integrated circuit interconnections; Plastics; Printed circuits; Production systems; Robotic assembly; Stability; Surface-mount technology;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/6104.778174

Filename

778174