Title :
Light-soaking effects on a-Si:H photodiodes deposited by the laminar-flow photo-CVD method
Author :
Ichinose, Hideo ; Nozaki, Hidetoshi ; Miyagawa, Ryohei ; Yamaguchi, Tetsuya ; Furukawa, Akihiko
Author_Institution :
Toshiba Corp., Yokohama, Japan
fDate :
10/1/2001 12:00:00 AM
Abstract :
A 2/3-in, 2-Mpixel, STACK-CCD imaging sensor has been developed for HDTV solid-state imagers. A new a-Si:H photo-conversion layer, fabricated by the laminar-flow photo-chemical-vapor-deposition method, is overlaid on the vertical CCD scanning circuitry in the sensor. The photodegradation behavior of a-Si:H photodiodes is investigated in terms of dark-current density, electron μτ product and transient photocurrent. These properties are degraded as a result of light-induced defects in the a-Si:H layer. The Staeblar-Wronski constants, Csw , are estimated to be 7.5×10-7 at no voltage and 1.1×10-7 at a reverse voltage of 6 V applied to the photodiode during light-soaking with an AM-1 lamp. The lifetime of the photodiode is determined by the degradation of the transient photocurrent, and is estimated to be about 2.2×108 h for 1 lx light exposure. The lifetime is considered to be improved compared with that of previous-type photodiode reported before (1.5×107 h for 1.5 lx light exposure) and clearly satisfies the needs for practical use of the device
Keywords :
CVD coatings; Staebler-Wronski effect; amorphous semiconductors; carrier lifetime; electron mobility; elemental semiconductors; hydrogen; photodiodes; silicon; 0.66 in; 2 Mpixel; HDTV solid-state imager; STACK-CCD imaging sensor; Si:H; Staeblar-Wronski constants; a-Si:H photodiode; dark current density; device lifetime; electron mobility-lifetime product; laminar-flow photo-chemical-vapor-deposition; light soaking; light-induced defects; photoconversion layer; photodegradation; transient photocurrent; Charge coupled devices; Degradation; Electrons; HDTV; Image sensors; Lamps; Photoconductivity; Photodiodes; Solid state circuits; Voltage;
Journal_Title :
Electron Devices, IEEE Transactions on