• DocumentCode
    1541091
  • Title

    Quench characteristics of Bi-2223 coil at liquid helium temperature

  • Author

    Oh, S.S. ; Wang, Q.L. ; Ha, H.S. ; Jang, H.M. ; Ha, D.W. ; Ryu, K.S. ; Nah, W.

  • Author_Institution
    Lab. of Appl. Supercond., Korea Electrotechnol. Res. Inst., Changwon, South Korea
  • Volume
    9
  • Issue
    2
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    1081
  • Lastpage
    1084
  • Abstract
    The quench characteristics of Bi-2223 single and four double pancake coils operating at liquid helium temperature were investigated based on experiments and numerical simulations. Broad resistive transition was observed in the double pancake coils. The Bi-2223 double pancake coil operating at liquid helium showed a slow normal zone propagation velocity. The stability margin of the coil was confirmed to be high because of the low operating temperature and a good cooling condition. The quench characteristics of a four double pancake coil system was simulated by a numerical method. It is clear that the protection resistance has a great influence on the current decay, transient voltage and hot-spot temperature.
  • Keywords
    bismuth compounds; calcium compounds; high-temperature superconductors; stability; strontium compounds; superconducting coils; Bi-2223 four double pancake coils; Bi-2223 single double pancake coil; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O coil; cooling condition; current decay; hot-spot temperature; liquid helium temperature; numerical simulation; protection resistance; quench characteristics; resistive transition; slow normal zone propagation velocity; stability margin; transient voltage; Critical current; Equations; Helium; High temperature superconductors; Magnetic fields; Numerical simulation; Protection; Stability; Superconducting coils; Voltage;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.783485
  • Filename
    783485