Title :
Table of contents
Abstract :
The following topics are dealt with: integrated circuit interconnection; 3D integration; reliability; process integration; materials and unit process; and carbon nanotubes.
Keywords :
carbon nanotubes; integrated circuit interconnections; reliability; three-dimensional integrated circuits; 3D integration; carbon nanotubes; integrated circuit interconnection; materials; process integration; reliability; unit process;
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
DOI :
10.1109/IITC.2014.6831824
