DocumentCode
154233
Title
Alternative metals for advanced interconnects
Author
Adelmann, C. ; Liang Gong Wen ; Peter, Antony Premkumar ; Yong Kong Siew ; Croes, Kristof ; Swerts, Johan ; Popovici, Mihaela ; Sankaran, K. ; Pourtois, G. ; Van Elshocht, S. ; Bommels, J. ; Tokei, Z.
Author_Institution
Imec, Leuven, Belgium
fYear
2014
fDate
20-23 May 2014
Firstpage
173
Lastpage
176
Abstract
We discuss the selection criteria for alternative metals in order to fulfill the requirements necessary for interconnects at half pitch values below 10 nm. The performance of scaled interconnects using transition metal germanides and CoAl alloys as metallization are studied and compared to conventional Cu and W interconnects.
Keywords
aluminium alloys; cobalt alloys; copper; integrated circuit interconnections; integrated circuit metallisation; tungsten; CoAl; CoAl alloys; Cu; W; alternative metals; metallization; scaled interconnects; transition metal germanidesadvanced interconnects; Coal; Conductivity; Electromigration; Films; Metallization; Scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location
San Jose, CA
Print_ISBN
978-1-4799-5016-4
Type
conf
DOI
10.1109/IITC.2014.6831863
Filename
6831863
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