• DocumentCode
    154243
  • Title

    Exploring alternative metals to Cu and W for interconnects: An ab initio insight

  • Author

    Sankaran, K. ; Clima, S. ; Mees, M. ; Adelmann, C. ; Tokei, Z. ; Pourtois, G.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2014
  • fDate
    20-23 May 2014
  • Firstpage
    193
  • Lastpage
    196
  • Abstract
    The properties of alternative metals to Cu and W for interconnect applications are reviewed based on first-principles simulations and benchmarked in terms of intrinsic bulk resistivity and electromigration.
  • Keywords
    copper; electrical resistivity; electromigration; integrated circuit interconnections; metals; tungsten; Cu; W; electromigration; first-principles simulations; interconnect metals; intrinsic bulk resistivity; Conductivity; Crystals; Electromigration; Metals; Prototypes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4799-5016-4
  • Type

    conf

  • DOI
    10.1109/IITC.2014.6831868
  • Filename
    6831868
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=154243