Title :
Electromigration induced failure of solder bumps and the role of IMC
Author :
Ceric, H. ; Selberherr, Siegfried
Author_Institution :
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
Abstract :
Characteristic for solder bumps is that during technology processing and usage their material composition changes. We present a model for describing the growth of an intermetallic compound inside a solder bump under the influence of electromigration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.
Keywords :
alloys; electromigration; integrated circuit interconnections; solders; IMC; electromigration induced failure; solder bumps; Chemicals; Integrated circuit interconnections; Nickel; Reliability; Resistance; Three-dimensional displays; Tin;
Conference_Titel :
Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2014 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4799-5016-4
DOI :
10.1109/IITC.2014.6831891
