Molecular dynamics study of thermally induced shear strain in nanoscale copper

Author

Heino, Pekka ; Ristolainen, Eero

Author_Institution

Inst. of Electron., Tampere Univ. of Technol., Finland

Volume

22

Issue

3

fYear

1999

fDate

8/1/1999 12:00:00 AM

Firstpage

510

Lastpage

514

Abstract

Thermally induced strain and stress were calculated in a nanoscale copper system using the molecular dynamics method. The shear strain in the system was generated by a mismatch in the coefficients of thermal expansion between the materials surrounding it. Plastic deformation mechanisms, stress concentration and stress relaxation were studied. The results show that initially the stress is concentrated in the corners of the system, as suggested by other studies. However, when the structure has been plastically deformed, high stress regions are found in the center of the system

Keywords

copper; molecular dynamics method; nanostructured materials; plastic deformation; shear deformation; stress relaxation; thermal expansion; thermal stresses; Cu; high stress regions; molecular dynamics study; nanoscale materials; plastic deformation mechanisms; stress concentration; stress relaxation; thermal expansion; thermally induced shear strain; Capacitive sensors; Computational modeling; Copper; Electric resistance; Mechanical factors; Plastics; Strain measurement; Temperature; Thermal expansion; Thermal stresses;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.784505

Filename

784505