Title :
Fast VLSI arithmetic algorithms for high-security elliptic curve cryptographic applications
Author :
Moon, Sangook ; Park, Jaemin ; Lee, Yongsurk
Author_Institution :
Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
fDate :
8/1/2001 12:00:00 AM
Abstract :
We propose new methods for calculating fast VLSI arithmetic algorithms for secure data encryption and decryption in the elliptic curve cryptosystem (ECC), and also verify the proof-of-concepts by numerical expressions and through the use of HDL (hardware description language). We have developed a fast finite field multiplier that utilizes a new concept, and a finite field divider with an improved internal structure, as well as a novel fast algorithm for calculating kP, which is the most time-consuming operation in the ECC data encryption scheme. The proposed multiplier features a higher throughput per cost ratio than any other existing Galois field (GF) multiplier that can be used in the large prime finite field. Furthermore, our improved divider shows better extensibility. The developed algorithm for point multiplication decreases the steps required for iteration by half compared to that of the traditional double-and-add algorithm. It also reduces the number of field multiplications by about 19% and that of field divisions by about 9%
Keywords :
Galois fields; VLSI; cryptography; decoding; digital arithmetic; dividing circuits; hardware description languages; multiplying circuits; telecommunication security; ECC data encryption; GF multiplier; Galois field multiplier; HDL; consumer electronics; double-and-add algorithm; fast VLSI arithmetic algorithms; fast finite field multiplier; field divisions reduction; field multiplications reduction; finite field divider; hardware description language; high-security elliptic curve cryptographic; point multiplication; secure data decryption; secure data encryption; throughput per cost ratio; Arithmetic; Costs; Data security; Elliptic curve cryptography; Galois fields; Hardware; Moon; Polynomials; Throughput; Very large scale integration;
Journal_Title :
Consumer Electronics, IEEE Transactions on