• DocumentCode
    1551007
  • Title

    Thermal budget calculations, design aspects, and device performance of high-Tc air-bridged microbolometers

  • Author

    Neff, H. ; Berg, M. ; Barth, R.

  • Author_Institution
    TZN Forschungs- und Entwicklungszentrum Unterluss GmbH, Germany
  • Volume
    7
  • Issue
    3
  • fYear
    1997
  • Firstpage
    3802
  • Lastpage
    3807
  • Abstract
    The thermal properties of an air-bridged microbolometer have been evaluated on the basis of a finite element calculation scheme for the first time. The numerical results show that the performance of the device´s sensitively depends on geometry and layout. The degree of thermal coupling and interaction with the heat sink affects the thermal time constant and frequency range of operation. For identical geometries, experimental and modeled data are in good agreement. The length of the air-bridge is defining the effective thermal time constant but has little effect on the thermal responsivity. An unusually high responsivity has been calculated for configurations where the thermal coupling to the heat sink has been minimized. This design leads to an increase of responsivity of a factor of 200 and would establish superior operation of the device even at ambient temperature.
  • Keywords
    bolometers; finite element analysis; heat sinks; high-temperature superconductors; submillimetre wave antennas; superconducting junction devices; HTSC air-bridged microbolometers; antenna coupled microbolometer; design aspects; finite element calculation; frequency range; heat sink interaction; numerical results; steady-state heat distribution; thermal budget calculations; thermal coupling; thermal responsivity; thermal time constant; Electric resistance; Frequency; Geometry; Heat sinks; Infrared detectors; Loaded antennas; Optical films; Optical receivers; Resistors; Steady-state;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.622978
  • Filename
    622978