Title :
Analysis of MWCNT and Bundled SWCNT Interconnects: Impact on Crosstalk and Area
Author :
Majumder, Manoj Kumar ; Pandya, Nisarg D. ; Kaushik, B.K. ; Manhas, S.K.
Author_Institution :
Dept. of Electron. & Comput. Eng., Microelectron. & Very Large Scale Integration Group, Indian Inst. of Technol. Roorkee, Roorkee, India
Abstract :
Multiwalled carbon nanotube (MWCNT) and bundled single-walled carbon nanotube (SWCNT) interconnect have provided potentially attractive solution in current deep submicrometer and nanoscale technology. This letter presents a comparative analysis between the MWCNT and the bundled SWCNT at different global interconnect lengths in terms of crosstalk-induced time delay and area by using a three-line-bus architecture. Each line of the bus architecture is replaced by the RLC models of the MWCNT and bundled-SWCNT interconnects. The crosstalk-induced time delay is predicted at the middle line (victim) when the other two lines (aggressors) are switched in the opposite direction. From HSPICE circuit simulation results, it has been observed that the overall improvement in the delay is 52.4% more for the MWCNT as compared with the equivalent bundled-SWCNT interconnects. Consequently, on an average, the MWCNT requires 97.8% lesser area as compared with the bundled-SWCNT interconnects for the same crosstalk-induced time delay.
Keywords :
RLC circuits; SPICE; carbon nanotubes; crosstalk; HSPICE circuit simulation; MWCNT; RLC models; bundled SWCNT interconnects; bundled single-walled carbon nanotube interconnect; comparative analysis; crosstalk-induced time delay; multiwalled carbon nanotube; nanoscale technology; three-line-bus architecture; Capacitance; Carbon nanotubes; Crosstalk; Delay; Delay effects; Integrated circuit interconnections; Resistance; Area; crosstalk; interconnect; multiwalled carbon nanotube (MWCNT); nanotechnology; single-walled carbon-nanotube (SWCNT) bundles;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2012.2200872