DocumentCode :
1558154
Title :
An automated workcell for meniscus coating on 24-in packaging substrates
Author :
Bhattacharya, Swapan K. ; Bhatevara, Sachin ; Sutter, Dean A. ; Kamen, EdwardW ; May, Gary S. ; Tummala, Rao R.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
24
Issue :
4
fYear :
2001
fDate :
12/1/2001 12:00:00 AM
Firstpage :
625
Lastpage :
630
Abstract :
Improved coating procedures are essential to the success of low-cost large substrate multichip module (MCM) fabrication, as existing coaters are slow and waste too much material. New coaters are needed that are able to coat large area substrates and have sufficient throughput and material savings to substantially reduce the manufacturing costs. The requirements for a large substrate coater include sufficient flexibility to coat a wide range of materials at various film thicknesses. This paper describes a meniscus coating workcell that meets these requirements. The complete coating workcell includes robotic material handling, automated sample transport, and convection drying of coated films. In-situ viscosity monitoring and in-line thickness measurements can be retrofitted into this workcell. Feasibility of a thin and uniform polymer coating with thickness on the order of a micrometer is demonstrated on a 24×24 in glass substrate using the automated coating operation. Preliminary study indicates that a throughput of ~20 substrates/h is achievable by optimizing the turnaround time of the coater heads, substrate holder, and substrate loading/unloading by the robot
Keywords :
coating techniques; drying; industrial robots; materials handling; multichip modules; process control; 24 in; automated sample transport; automated workcell; coater heads; coating procedures; convection drying; large area substrates; manufacturing costs; material savings; meniscus coating; multichip module fabrication; packaging substrates; polymer coating; robotic material handling; substrate holder; substrate loading/unloading; thickness measurements; throughput; turnaround time; viscosity monitoring; Coatings; Costs; Fabrication; Manufacturing; Multichip modules; Packaging; Robotics and automation; Substrates; Throughput; Waste materials;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.974951
Filename :
974951
Link To Document :
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