Title :
Single mode fiber MT-RJ SFF transceiver module using optical subassembly with a new shielded silicon optical bench
Author :
Iwase, Masayuki ; Nomura, Takehiko ; Izawa, Atsushi ; Mori, Hajime ; Tamura, Shuichi ; Shirai, Takehiro ; Kamiya, Tamotsu
Author_Institution :
Opt. Devices Dept., Furukawa Electr. Co. Ltd., Chiba, Japan
fDate :
11/1/2001 12:00:00 AM
Abstract :
Demand for a compact cost reduced optical transceiver has arisen. Small form factor (SFF) optical transceivers are expected to meet this demand. A new concept optical module based on V-grooved silicon optical bench (SiOB) technology, that enables a passive alignment of optical fibers and optical devices is expected to reduce the cost. MT-RJ SFF optical transceivers require this new packaging technique because the distance between input and output optical axes is shorter than conventional transceivers. However, crosstalk between a transmitter and a receiver is a big issue to be solved because the distance between optical axes of the laser diode (LD) and the photo diode (PD) is only 0.75 mm. It is difficult to reduce the crosstalk in a SiOB because large electromagnetic coupling exists due to the conductivity of a silicon substrate. A newly developed, low crosstalk optical subassembly (OSA) with a single mode fiber MT-RJ receptacle and the SFF transceiver module are reported. We have analyzed a mechanism of electrical crosstalk in a SiOB and developed a shield structure to reduce it. The crosstalk in the OSA with shielded SiOB was reduced over 20 dB compared to the unshielded SiOB
Keywords :
SONET; optical communication equipment; optical couplers; optical crosstalk; optical fibre networks; packaging; synchronous digital hierarchy; transceivers; 0.75 mm; MT-RJ connector; SONET/SDH; Si; V-grooved technology; crosstalk; electromagnetic coupling; optical subassembly; optical transceivers; packaging technique; passive alignment; shield structure; shielded silicon optical bench; single mode fiber; small form factor; Costs; Diode lasers; Optical crosstalk; Optical devices; Optical fibers; Optical receivers; Optical transmitters; Packaging; Silicon; Transceivers;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.982824