DocumentCode :
1561164
Title :
Foreword
Volume :
1
fYear :
2005
Abstract :
Presents the welcome message from the conference proceedings.
Keywords :
Asia; Components, Packaging, and Manufacturing Technology Society; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit packaging; Lead; Materials reliability; Organizing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
Type :
conf
DOI :
10.1109/EPTC.2005.1614354
Filename :
1614354
Link To Document :
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