Title :
Circuit model of elastomer probe for fine pitch wafer level package test applications
Author :
Jayabalan, J. ; Ooi, B.L. ; Leong, M.S. ; Iye, M.K.
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
A novel elastomer probe meant for wafer level packaged device test applications at multi-gigahertz frequencies given tight mechanical constraints such as very fine pitch (of the order of 100 micron) and large pin count (of thousands per square centimeter) is modeled by partial element equivalent circuit (PEEC) method. The model is verified through insertion loss and return loss measurements on a prototype coplanar probe
Keywords :
elastomers; equivalent circuits; fine-pitch technology; integrated circuit packaging; plastic packaging; probes; PEEC method; circuit model; elastomer probe; fine pitch technology; fine pitch wafer level package test; insertion loss measurements; mechanical constraints; partial element equivalent circuit method; prototype coplanar probe; return loss measurements; Circuit testing; Equivalent circuits; Frequency; Insertion loss; Loss measurement; Packaging; Probes; Prototypes; Semiconductor device modeling; Wafer scale integration;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614390
