DocumentCode :
1561977
Title :
Prototype development for chip-chip interconnection by multimode waveguide
Author :
Pong, Bryan Lee Sik ; Pamidigantham, R. ; Premachandran, C.S.
Author_Institution :
A*Star Inst. of Microelectron., Singapore
Volume :
2
fYear :
2005
Abstract :
A low cost multimode polymer waveguide has been developed for chip to chip communications application. Due to the application is design for short distance communications, 850 nm wavelength is chosen in this case. We have chosen SU 8 as the core waveguide due to its highly transparent in 850 nm range with high thermal stabilities of >200 degree C and low moisture intakes. A propagation loss of less than 1 dB/cm at 850 nm has been achieved by using a cut back method. Optical measurements found that no change in the propogation loss after going through standard reflow temperature profile used for printed circuit board (PCB)
Keywords :
optical interconnections; optical polymers; optical waveguides; printed circuits; 850 nm; chip to chip communications; chip-chip interconnection; core waveguide; cut back method; moisture intakes; multimode polymer waveguide; optical measurements; printed circuit board; propogation loss; short distance communications; standard reflow temperature profile; thermal stability; Costs; Integrated circuit interconnections; Loss measurement; Moisture; Optical losses; Optical waveguides; Polymers; Propagation losses; Prototypes; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
Type :
conf
DOI :
10.1109/EPTC.2005.1614453
Filename :
1614453
Link To Document :
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