High performance conductive adhesives modified with molecular wires

Different types of self-assembled monolayers (SAMs) were used to treat nano Ag fillers. Self-assembled monolayer (SAM) molecules wires can act as electrical junctions between the conductive filler of the ACA and the contact pad of the substrate, as such, the interfaces between the conductive fillers and contact pad could be enhanced. Thermogravimetric analyzer (TGA), differential scanning calorimeter (DSC), and contact angle results indicated the SAMs were well coated on the nano Ag particles. Furthermore, these molecular wire-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel molecular wires into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were further improved due to the stronger bonding between nano fillers and SAM and consequently the improved interface properties of the high performance ACA for potential microprocessor applications