• DocumentCode
    156342
  • Title

    Formation of chips with passive part by the alumina technology for microwave attenuator

  • Author

    Litvinovich, G.V. ; Sokol, V.A.

  • Author_Institution
    Belarusian State Univ. of Inf. & Radioelectron., Minsk, Belarus
  • fYear
    2014
  • fDate
    7-13 Sept. 2014
  • Firstpage
    677
  • Lastpage
    678
  • Abstract
    The paper concerns the application of the electrochemical alumina technology for the formation of chips with passive part for microwave attenuators. The structure of this chip consists of an aluminum base with an anodic dielectric Al2O3 layer, copper strip lines and contact pads at the alumina surface, and a thin-film resistor. Experimental results verify availability of this technology for the microwave attenuator manufacturing.
  • Keywords
    aluminium compounds; attenuators; dielectric materials; microwave circuits; Al2O3; anodic dielectric layer; chip formation; contact pads; copper strip lines; electrochemical alumina technology; microwave attenuator; passive part; thin-film resistor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave & Telecommunication Technology (CriMiCo), 2014 24th International Crimean Conference
  • Conference_Location
    Sevastopol
  • Print_ISBN
    978-966-335-412-5
  • Type

    conf

  • DOI
    10.1109/CRMICO.2014.6959580
  • Filename
    6959580
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=156342