Title :
A silicon condenser microphone with a highly perforated backplate
Author :
Bergqvist, J. ; Rudolf, F. ; Maisano, J. ; Parodi, F. ; Ross, M.
Author_Institution :
Centre Swisse d´´Electron. et de Microtech., S.A., Neuchatel, Switzerland
Abstract :
Condenser microphone chips in monocrystalline silicon have been designed and realized with a technology that is well adapted to batch fabrication. The novel design has a thin and highly perforated backplate in combination with an air-gap of 2 mu m. The device has a low bias voltage of 5 V, a frequency response within +or-3 dB from 2 Hz to 20 kHz, and sensitivities in the range of 1 to 2 mV/Pa. Simulations with equivalent acoustical circuits agree well with experimental data up to a frequency of 15 kHz.<>
Keywords :
diaphragms; elemental semiconductors; microphones; silicon; 2 Hz to 20 kHz; Si condenser microphone; batch fabrication; elemental semiconductor; equivalent acoustical circuits; frequency response; low bias voltage; perforated backplate; sensitivities; simulation; Air gaps; Capacitance; Capacitive sensors; Damping; Fabrication; Frequency response; Microphones; Silicon; Ventilation; Wafer bonding;
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
DOI :
10.1109/SENSOR.1991.148857
