High performance writer using high moment sputtered films in top and bottom poles

Summary form only given. Sputter deposited materials are advantageous over traditional electroplated materials in terms of high moment, soft magnetic properties, high frequency performance, low magnetostriction, and corrosion resistance. Incorporating sputtered deposited materials in write heads requires advanced wafer processing technology. Novel patterning techniques and new writer design are often needed. In a previous study, sputter deposited high moment film was used as flux enhancement layer at the bottom of top pole. In this study, high moment sputtered materials was also introduced as the bottom pole pedestal, which resulted in further improvement in writer performance.