Title :
Table of contents
Abstract :
The following topics were discussed: 300mm fabrication; advanced metrology; lithography challenges; advanced materials and processing; defect inspection; yield control and enhancement; advanced process control; factory automation and factory dynamics; cost reduction; equipment reliability and productivity.
Keywords :
factory automation; inspection; integrated circuit manufacture; integrated circuit measurement; integrated circuit reliability; integrated circuit yield; lithography; process control; productivity; spatial variables measurement; 300mm fabrication; advanced process control; advanced semiconductor manufacturing; cost reduction; defect inspection; equipment reliability; factory automation; factory dynamics; lithography; metrology; productivity; size 300 mm; yield control;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
978-1-4244-1964-7
DOI :
10.1109/ASMC.2008.4528993
