• DocumentCode
    1572020
  • Title

    Carbon nanotube bundle interconnect: Performance evaluation, optimum repeater size and insertion for global wire

  • Author

    Patel, Dipen ; Kim, Yong Bin

  • Author_Institution
    Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
  • fYear
    2010
  • Firstpage
    749
  • Lastpage
    752
  • Abstract
    To remove the bottleneck of the interconnect especially at semi-global and global level, performance evaluation of local, semi global, and global interconnect is presented in this paper based on carbon nanotube (CNT) interconnect bundle model. For the greater length of the wire, a methodology is presented to find the optimum insertion and size of buffer for CNT bundle interconnects. The performance analysis for repeater shows that the CNT bundle can run 2.58 times longer without repeater insertion and requires 31% less buffer size than Cu wire.
  • Keywords
    carbon nanotubes; integrated circuit interconnections; carbon nanotube bundle interconnect; global wire; optimum repeater size; performance analysis; performance evaluation; Carbon nanotubes; Conductivity; Contact resistance; Copper; Electrons; Inductance; Integrated circuit interconnections; Repeaters; Scattering; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
  • Conference_Location
    Seattle, WA
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-7771-5
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2010.5548711
  • Filename
    5548711