DocumentCode
1574532
Title
Silicon nanowire pirani sensor fabricated using FIB lithography
Author
Henry, M.D. ; Shaner, Eric ; Jarecki, R.
Author_Institution
MESA Fabrication Facility, Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2013
Firstpage
91
Lastpage
92
Abstract
As radio frequency microelectromechanical systems (RF-MEMS) mature as a manufacturable technology, packaging of the devices becomes increasingly important. Devices such as aluminum nitride (AlN) RF-filters require packaging which is either hermetic or under vacuum to protect the devices [1]. It then becomes critical to have a measurement of pressure inside the packaged chamber. Typically for this need, Pirani gauges are fabricated using poly silicon or metal patterned on suspended membranes [2]. These type of devices increase die area, add complexity to fabrication flows, and difficulty when attempting to suspend the membranes. In this work we fabricate and characterize a suspended silicon nanowire for use as Pirani gauge by utilizing Ga lithography and plasma reactive ion etching for defining the nanowire geometry and simultaneously releasing the wire. This method benefits from the high surface to volume ratio inherent in the nano regime, decreased thermal conductivity of amorphous silicon (from implantation) and increased electrical conductivity of Ga doping to reduce device area and fabrication complexity of a Pirani gauge.
Keywords
amorphous semiconductors; elemental semiconductors; gallium; ion beam lithography; ion implantation; nanosensors; nanowires; semiconductor doping; silicon; sputter etching; FIB lithography; Ga; Ga lithography; Pirani gauges; Pirani sensor; RF filter; RF-MEMS; Si; amorphous silicon; electrical conductivity; focused ion beam lithography; gallium doping; hermetic packaging; nanowire geometry; plasma reactive ion etching; polysilicon; pressure measurement; radio frequency microelectromechanical systems; silicon nanowire sensor; suspended membrane; suspended silicon nanowire; thermal conductivity; vacuum packaging; Conductivity; Lithography; Plasma temperature; Pressure measurement; Silicon; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2013 71st Annual
Conference_Location
Notre Dame, IN
ISSN
1548-3770
Print_ISBN
978-1-4799-0811-0
Type
conf
DOI
10.1109/DRC.2013.6633808
Filename
6633808
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