Electrocontact microdisplacement testing subsystem

Author

Zagursky, V. ; Zibinch, Dz

Author_Institution

Inst. of Electron. & Comput. Sci., Latvian Univ., Riga, Latvia

Volume

1

fYear

1999

fDate

6/21/1905 12:00:00 AM

Firstpage

521

Abstract

The subsystem relates to control, testing and measurement instrumentation with closed digital control loop structure and may be used, in particular, for testing and measurement of smooth displacements resulting from, for example, force or temperature deformation of an object, or for detection of changes in geometric dimensions of an object while monitoring its airtightness, e.g. monitoring the airtightness of integrated circuit packages. Also, it may be used with some additions for tactile sensing in robotic systems

Keywords

closed loop systems; digital control; displacement measurement; integrated circuit packaging; integrated circuit testing; microsensors; monitoring; airtightness; circuit packages; closed digital control loop structure; control instrumentation; electrocontact microdisplacement testing subsystem; force deformation; geometric dimensions; integral circuits; integral microcircuits; measurement instrumentation; robotic systems; smooth displacements; tactile sensing; temperature deformation; testing instrumentation; watertightness; Circuit testing; Displacement control; Displacement measurement; Force control; Force measurement; Instruments; Integrated circuit testing; Monitoring; Particle measurements; Temperature control;

fLanguage

English

Publisher

ieee

Conference_Titel

Africon, 1999 IEEE

Conference_Location

Cape Town

Print_ISBN

0-7803-5546-6

Type

conf

DOI

10.1109/AFRCON.1999.820943

Filename

820943