DocumentCode
1578034
Title
EMC-driven placement for MCM
Author
Feng, Wu-Shiung ; Tseng, Yaw-hua
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
1997
Firstpage
364
Lastpage
367
Abstract
In this paper, we use the hierarchical placement algorithm to implement EMC driven MCM placement. To ensure that every maximal connection chip pairs are placed as close as possible, we provide a clustering development algorithm. A proper model for EMC-driven MCM placement is used in this work. By this model, we use a short wire antenna to simulate the radiation of each chip on the substrate. At present, we have implemented an MCM placement program successfully, and this program can output the layout with a CIF form
Keywords
circuit layout CAD; electromagnetic compatibility; multichip modules; CIF form; EMC-driven placement; MCM; clustering development algorithm; hierarchical placement algorithm; layout; maximal connection chip pairs; radiation; short wire antenna; Multichip modules;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility Proceedings, 1997 International Symposium on
Conference_Location
Beijing
Print_ISBN
0-7803-3608-9
Type
conf
DOI
10.1109/ELMAGC.1997.617163
Filename
617163
Link To Document