Title :
Optical through-hole with high aspect ratio for on-board optical transmission
Author :
Takagi, Yutaka ; Suzuki, Atsushi ; Horio, Toshikazu ; Ohno, Takeshi ; Kojima, Toshifumi ; Takada, Toshikatsu ; Iio, Satoshi ; Obayashi, Kazushige ; Okuyama, Masahiko
Author_Institution :
R&D Center, NGK Spark Plug Co., Ltd., Komaki, Japan
Abstract :
We developed optical I/Os in packages for chip-to-chip interconnections. The I/Os of 55-μm-diameter and 1.2-mm-long optical through-holes demonstrate low loss and 10-Gb/s transmission. This package aims at future CPU systems with embedded capacitors.
Keywords :
electronics packaging; integrated optoelectronics; optical fibre communication; optical interconnections; CPU systems; bit rate 10 Gbit/s; chip-to-chip interconnections; embedded capacitors; high aspect ratio; on-board optical transmission; optical I/O; optical through-hole; size 1.2 mm; size 55 mum; High speed optical techniques; Optical coupling; Optical device fabrication; Optical fibers; Optical interconnections;
Conference_Titel :
Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2011 and the National Fiber Optic Engineers Conference
Conference_Location :
Los Angeles, CA
Print_ISBN :
978-1-4577-0213-6
