DocumentCode :
1582532
Title :
Microstructure and Property of TiB2-Dispersed Cu-matrix Composites
Author :
Kim, Ji-Soon ; Kum, Jong-Won ; Kang, Eun-Hee ; Nguyen, Dang-Thuy ; Kim, Jin-Chun ; Kwon, Yong-Soon
Author_Institution :
Sch. of Mater. Sci. & Eng., Ulsan Univ.
fYear :
2006
Firstpage :
366
Lastpage :
368
Abstract :
In the present work, the microstructure and properties of Cu-based composites with 4.5 vol.% dispersed TiB2 particles developed by a combined process of mechanical alloying (MA), self-propagate high temperature synthesis (SHS) and spark-plasma sintering (SPS) will be reported. The microstructure of the composites revealed that the TiB2 dispersoids with the particle size of smaller than 250 nm uniformly distributed in Cu matrix. The sintered samples obtained approximately 99% in relative density after sintering at 650 degC for 5 min. The fine dispersed TiB2 dispersoids in Cu matrix was the main reason to improve the mechanical properties of the composites. The hardness reached a value of 74 HRB. The result of tensile test showed that the ultimate tensile strength, yield strength and Young modulus increased from 187 MPa, 158 Mpa and 119 GPa for pure Cu to 485.7 MPa, 355.3 MPa and 157 GPa for the composites, whereas the electrical conductivity remained a high value of 83 % IACS. After soaking at 850, 900 and 950 degC, the hardness of composites decreased to 62, 61 and 55 HRB, respectively. The softening temperature was determined to be higher than 900 degC.
Keywords :
Young´s modulus; combustion synthesis; copper; hardness; mechanical alloying; particle reinforced composites; particle size; plasma materials processing; sintering; softening; tensile testing; titanium compounds; yield strength; 157 GPa; 158 MPa; 485.7 MPa; 650 degC; 850 degC; 900 degC; Cu-TiB2; Young modulus; copper matrix composites; electrical conductivity; mechanical alloying; mechanical properties; relative density; self-propagate high temperature synthesis; spark-plasma sintering; tensile strength; tensile test; yield strength; Ball milling; Conducting materials; Copper alloys; Electrodes; Mechanical factors; Microstructure; Plasma temperature; Powders; Thermal conductivity; Titanium; Cu-TiB2 nanocompostes; MA; Microstructure; SHS; SPS; mechanical & electrical properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Strategic Technology, The 1st International Forum on
Conference_Location :
Ulsan
Print_ISBN :
1-4244-0426-6
Electronic_ISBN :
1-4244-0427-4
Type :
conf
DOI :
10.1109/IFOST.2006.312334
Filename :
4107406
Link To Document :
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