Abstract :
The following topics were dealt with: microsystems integration; advanced packaging; assembly and manufacturing; material processing; and industrial equipment
Keywords :
assembling; micromechanical devices; packaging; advanced packaging; assembly; industrial equipment; manufacturing; material processing; microsystems integration;
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0734-6
DOI :
10.1109/IMPACT.2006.312165
