Title :
Thermal Packaging Challenges and Opportunities at the Micro and Nano Scales
Author :
Bar-Cohen, Avram
Author_Institution :
Dept. of Mech. Eng., Maryland Univ., MD
Abstract :
Microsystem technology is a key driver in the rapid migration of thermal science and technology towards the micro and nano scales. The deleterious effects of heat generation and thermally-induced failures of micro/nano electronic and photonic components have necessitated the development of thermal packaging solutions at progressively smaller scales. This lecture will define the emerging micro/nano thermal packaging challenges and explore solid state refrigeration and dielectric liquid cooling techniques for addressing on-chip hot spots in high heat flux chips, as well as the use of high conductivity polymer composites for cooling of notebook and portable computers. Thermo-optic issues in the use of polymer waveguides and gratings will also be considered
Keywords :
composite materials; conducting polymers; cooling; heat sinks; integrated circuit packaging; integrated optics; nanoelectronics; refrigeration; thermal management (packaging); thermo-optical effects; dielectric liquid cooling techniques; gratings; heat flux chips; heat generation; high conductivity polymer composites; micro scales; microsystem technology; nano scales; on-chip hot spots; photonic components; polymer waveguides; solid state refrigeration; thermal packaging challenges; thermally-induced failures; thermo-optic issues; Dielectric liquids; Driver circuits; Electronic packaging thermal management; Electronics cooling; Gratings; Polymers; Portable computers; Refrigeration; Solid state circuits; Thermal conductivity;
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
DOI :
10.1109/IMPACT.2006.312170
